The Multidimensional Integrated Intelligent Imaging project (MI-3)

Abstract:: MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop complementary metal-oxide semiconductor (CMOS) active pixel sensors (APS) and to apply these sensors to a range of imaging challenges. A range of sensors has been developed: On-Pixel Intelligent CMOS (OPIC)—designed for in-pixel intelligence; FPN—designed to develop novel techniques for reducing fixed pattern noise; HDR—designed to develop novel techniques for increasing dynamic range; Vanilla/PEAPS—with digital and analogue modes and regions of interest, which has also been back-thinned; Large Area Sensor (LAS)—a novel, stitched LAS; and eLeNA—which develops a range of low noise pixels. Applications being developed include autoradiography, a gamma camera system, radiotherapy verification, tissue diffraction imaging, X-ray phase-contrast imaging, DNA sequencing and electron microscopy.

Authors:: N Allinson, T Anaxagoras, J Aveyard, C Arvanitis, R Bates, A Blue, S Bohndiek, J Cabello, L Chen, S Chen, A Clark, C Clayton, E Cook, A Cossins, J Crooks, M El-Gomati, PM Evans, W Faruqi, M French, J Gow, T Greenshaw, T Greig, N Guerrini, EJ Harris, R Henderson, A Holland, G Jeyasundra, D Karadaglic, A Konstantinidis, HX Liang, KMS Maini, G McMullen, A Olivo, V O'Shea, J Osmond, RJ Ott, M Prydderch, L Qiang, G Riley, G Royle, G Segneri, R Speller, JRN Symonds-Tayler, S Triger, R Turchetta, C Venanzi, K Wells, X Zha, H Zin

Journal:: Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment

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